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Components
Nanowire & Nanowire CVD Filaments
Plasma Enhancement/Etch Options
Robotic & Manual Transfer Systems
Vapor Delivery System/Filter/Condensers
Robotic & Manual Transfer Systems
SMI provides a complete line of substrate (wafer) or substrate on a platter (susceptor) transfer systems in manual or robotic configurations. Depending on the need SMI has provided linear transfer arms, typically with magnetic coupling axial motion and Z-motions predominantly for transferring a single substrate or substrates on a susceptor or wafer carrier. Alternatively cluster tool configurations have used a central robot transfer hub.
Structured Materials Industries, Inc. (SMI) offers automatic robotic and manual trandsfer load lock systems for substrate and or wafer carrier loading and unloading into our reactors or for custom homebuilt systems. The video shows two cycles of a load rotate and unload process; simulating an actual run cycle. Shown is 5" wafer arrier configured for three 2" wafers. Many other size transfer systems are also available.
Robotic & Manual Transfer Systems
Robotic and Manual Transfer Systems
Wafer Carriers
Wafer Carriers & Susceptors
SMI has experience with many different wafer carrier and susceptor materials and sizes. This includes materials of construction, methods of securing wafers, process compatible designs, and other features. We have different configurations available from 1” to 34” diameter carriers as well as rectangular and custom shapes. A great number of materials have been used to make susceptors and wafer carriers; including graphite, molybdenum, stainless steel, Al2O3, SiC, Si, Si3N4, SiC coated graphite, TaC coated graphite, Haynes and Hastelloy aluminum, SiC coated graphite and so on. Many of which are shown in the images.
Heating FIlaments
Heating Filaments and Assemblies
CVD processes encompass a great number of materials, process environments, and process chemistries. The environment can include inert, reducing, oxidizing, or other atmospheres; the temperatures can vary greatly from room temperatures to about 2400 deg C; temperature can vary greatly from low pressures (<10^-6 atm to greater than a few atmospheres), the process chemically can also create acids and bases. Plasma and associated excited and reactive species may also be present. Thus, depending on the materials and process parameters, a very wide range of heating methods may be called upon. SMI has implemented a great range of heating approaches including filaments Graphite, Tungster, Hastelloy, MoS2 and SiC among other lamps, induction, and even direct current resistance heating of the material as in a tape.
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